Muhannad Bakir
Professor, School of Electrical & Computer Engineering
Integrated 3D Systems Group
Georgia Institute of Technology
Associate Director, Interconnect and Packaging Center Microelectronics/Microsystems
Three-dimensional (3D) electronic system integration, advanced cooling and power delivery for 3D systems, biosensor technologies and their integration with signal processing circuitry, carbon based nanoelectronics, nanofabrication technology, novel interconnect systems.
The Bakir lab is interested in three-dimensional (3D) electronic system integration, advanced cooling and power delivery for 3D systems, biosensor technologies for cancer and other diseases and their integration with signal processing circuitry, carbon based nanoelectronics, nanofabrication technology, novel interconnect systems.